Thin-Film Passives in RF/Microwave Circuits

Thin-Film Passives in RF/Microwave Circuits
Written By: Ron Demcko

Abstract:
Until recently, most microwave capacitors were based on fired multilayer ceramic technology. In this process, layers of highly conductive electrode metal alloys are interleaved with low-loss ceramic dielectrics in a multilayer fashion until the target capacitance is obtained. The resulting stack is then sintered into a monolithic structure in a high-temperature firing process. This process continues to satisfactorily serve highpower capacitor needs in addition to those in larger value RF capacitors…
DOWNLOAD TECHNICAL PAPER