FOUNTAIN INN, S.C. (May 5, 2016) – AVX Corporation, a leading manufacturer of passive components and interconnect solutions, will deliver two technical presentations about advanced ceramic and tantalum capacitor technology specifically designed for extended high temperature operation at the International Microelectronics Assembly and Packaging Society’s (IMAPS’) International Conference on High Temperature Electronics (HiTEC 2016), which will take place May 10 – 12, 2016 in Albuquerque, New Mexico.
“As the industry’s premier biennial technical conference for high temperature electronics, HiTEC is an important forum for AVX engineers to participate in the advancement of the next generation of electronic components for applications subjected to extended elevated temperatures,” said Dave DuPré, field applications engineer at AVX. “Our high-temperature development work includes both ceramic and tantalum capacitor technologies that are used in a wide range of harsh environment applications.”
HiTEC 2016 is the leading industry conference dedicated to the advancement of research and applications on high temperature electronics. The biennial conference provides component and application engineers and researchers with an opportunity to exchange information and network with colleagues from around the world in an effort to advance state-of-the-art high temperature electronics and applications. In addition to the technical program, which consists of more than 45 paper presentations, HiTEC 2016 will feature three plenary sessions about high-temperature applications delivered by industry experts, in addition to a product exhibition and a day-long short course designed to provide engineers with a comprehensive review of electronic component characteristics and performance in high-temperature environments.
Dave DuPré of AVX will deliver two presentations in this year’s Capacitors and Filters session. The first, “Capacitor Technologies for High Temperature and Harsh Environment Applications,” authored by AVX technical marketing manager, Chris Reynolds, addresses advancements in materials, component design and packaging, and testing procedures for solid and wet tantalum capacitors, as well as design considerations for their employment in applications with operating temperatures this exceed 200°C, such as down-hole oil exploration, underhood automotive electronics, and military and aerospace systems.
The second presentation, “High Temperature Surface Mount MLCC Technology Update,” examines the most recent developments in ceramic SMT and leaded capacitor technologies specifically designed for high temperature environments, and focuses on the qualification of devices rated up to 250°C, as well as the characterization of high-temperature dielectrics compared to conventional devices rated for 150°C or 175°C.
For more information about AVX, please contact us.
The International Microelectronics Assembly and Packaging Society (IMAPS) is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging technologies through professional education. The Society’s portfolio of technologies is disseminated through symposia, conferences, workshops, professional development courses and other efforts. IMAPS currently has more than 3,000 members in the United States and more than 3,000 international members around the world. For more information about IMAPS, please visit http://www.imaps.org/.
The IMAPS International Conference on High Temperature Electronics (HiTEC), is the leading biennial conference dedicated to the advancement and dissemination of information in the high temperature electronics industry. HiTEC 2016 scheduled for May 10 – 12, 2016 in Albuquerque, NM. For more information about HiTEC, please visit http://www.imaps.org/hitec/index.htm.