White Papers

Wireless Charging

Wireless Charging

Wireless Charging Written By: Ron Demcko Abstract: Yesterday’s dream of distributing power wirelessly is becoming a reality based upon exceptional efforts of industry regulatory agencies, component manufacturers, and design engineers with long-term vision. The use of wireless charging is expected to increase dramatically as consumers are freed from carrying bulky cables that have extra weight and the potential to wear out the mechanisms associated with them. Implementation of wireless charging schemes are easier than ever thanks to a wide availability of dedicated chip sets. Within the topic of wireless charging – there are several different power levels, architectures, and design approaches associated with wireless power transfer. This paper will serve as a starting point and describe the families of capacitors

Optimizing Antenna Performance Through the Use of High Q, Tight Tolerance Capacitors

Optimizing Antenna Performance Through the Use of High Q, Tight Tolerance Capacitors

Optimizing Antenna Performance Through the Use of High Q, Tight Tolerance Capacitors Written By: Ron Demcko Abstract: Antenna matching is an important aspect of any RF system. Thinking in traditional terms, a properly designed and matched antenna increases the operating distance of the wireless product. Well matched antennas can transmit more power from the radio – therefore transmit over longer distances. Likewise, a well matched antenna allows the maximum transfer of energy from the receiving antenna to the receiver front end. Thus, allowing better receive characteristics for the system. But the use of a capacitor can also have a big impact upon the physical size of an antenna. If the goal is a compact, integrated antenna, the use of a

Temperature Stability Assessment of GaN Power Amplifiers with Matching Tantalum Capacitors

Temperature Stability Assessment of GaN Power Amplifiers with Matching Tantalum Capacitors

Temperature Stability Assessment of GaN Power Amplifiers with Matching Tantalum Capacitors Written By: T.Zednicek | R.Demcko | M.Weaver | D.West | T. Blecha | F.Steiner | J.Svarny | R.Linhart Abstract: Wide band gap GaN and SiC devices are expected to experience high levels of growth in applications ranging from power conversion to RF transistors and MMICs. End users recognize the advantages of GaN technology as an ability to operate under higher currents and voltages. RF GaN market is expected to grow at 22.9 % CAGR over 2017-2023, boosted by implementation of 5G networks. [1] During the past years, the wide band semiconductors have reported achievement of >1000 V BDV that opens new challenges for high power industrial applications such as

Solid Tantalum Capacitors: MnO2 vs. Polymer Cathodes for Optimal Performance in High-Reliability Military and Space Applications

Solid Tantalum Capacitors: MnO2 vs. Polymer Cathodes for Optimal Performance in High-Reliability Military and Space Applications

Solid Tantalum Capacitors: MnO2 vs. Polymer Cathodes for Optimal Performance in High-Reliability Military and Space Applications Written By: Ron Demcko Abstract: Solid tantalum capacitors have a long history of proven performance in high-reliability military and space applications. But not all capacitors are created equal — even within the same class. As is the case with virtually all component technologies, materials matter. This paper will discuss the differences in performance and reliability between solid tantalum capacitors with manganese dioxide (MnO2) cathodes and those with conductive polymer cathodes. Bell Laboratories introduced the first solid tantalum capacitors to market in the early 1950s. The first military specification for surface-mount tantalum capacitors (MIL-PRF-55365) was released in 1989 and introduced CWR09-style components. Since then, the

Reliability of SuperCapacitors: Long-Term Reliability Test Data

Reliability of SuperCapacitors: Long-Term Reliability Test Data

Reliability of SuperCapacitors: Long-Term Reliability Test Data Written By: Eric DeRose | Bob Knopsnyder | Bharat Rawal Abstract: Extensive testing of electronic components is required for an understanding of their device physics, their degradation behavior and their failure mechanisms for establishing their longterm reliability. Gaining a better understanding of part characteristics results in the utilization of the right part which can be recommended to customers depending on the application’s operating conditions such as voltage, temperature and relative humidity. Samples of all products produced are evaluated and tested for up to 4,000 hours to establish reliability test data. As we strive to be an industry leader in reliability of our supercapacitors or electric double-layer capacitors, we do our due diligence by

Reliability of SuperCapacitors: Unique Performance at 85°C & Self-Balancing

Reliability of SuperCapacitors: Unique Performance at 85°C & Self-Balancing

Reliability of SuperCapacitors: Unique Performance at 85°C & Self-Balancing Written By: Eric DeRose | Bob Knopsnyder | Bharat Rawal Abstract: Increasing use of supercapacitors on printed circuit boards (PCBs) is requiring a further understanding of the reliability of these components. As the use of these types of devices increases, the emphasis on reliability will become critical as sub-ppm failure rates are critical for minimizing and, in fact, eliminating rework of the PCBs in these applications. A broader understanding of the reliability of these devices will assist in reaching this goal. In this first of many publications, a study of our supercapacitor modules tested at 85°C at various applied voltages, at or below the rated voltage, will demonstrate the impact of

RF Passive Components Made Using Multi-Layer Organic Technology

RF Passive Components Made Using Multi-Layer Organic Technology

RF Passive Components Made Using Multi-Layer Organic Technology Written By: Ron Demcko Abstract: RF circuitry might be based upon the use of discrete components, low temperature co-fired ceramics (LTCC), hybrid component technology, a combination of all these or more design methods/techniques – depending upon the frequency spectrum, circuit type and power of the circuit. A new family of RF components based upon laminating multiple layers of organic materials is emerging. These Multi-Layer Organic devices (MLO) offer significant electrical, physical and reliability advantages over traditional discrete RF or LTCC solutions. This paper outlines the basics of MLO devices. A discussion of the families of product offering and discusses performance advantages of MLO technology is provided.

High-Reliability Solid Tantalum Capacitors

High-Reliability Solid Tantalum Capacitors

High-Reliability Solid Tantalum Capacitors Written By: Bob Fairey Abstract: Solid tantalum capacitors are among the most popular types of small, surface-mount capacitors for electronic applications across the consumer, automotive, aerospace, and medical device markets. This paper will provide some context on the development of tantalum capacitor technology and address issues frequently faced by users, including the need for low equivalent series resistance (ESR) in filtering applications and the need for the highest possible reliability and long-lifetime performance in aerospace and medical applications.

EMI Control

EMI Control

EMI Control Written By: Ron Demcko Abstract: EMI control is a key design goal in electronic systems. Three terminal FeedThru capacitor filters are one component option that can be used to simplify designs needing a broadband EMI filter response. The proper selection and use of SMT FeedThrus can lead to a variety of system improvements such as: reduced overall component count, less complex PCB layout, increasing manufacturability, improved reliability, and lower weight. It is because of these potential advantages that three terminal capacitors are now accepted in designs ranging from avionics to cell phones, automobiles to SMART grid controllers. This list of applications is growing as FeedThru capacitors evolve into smaller packages, obtain AEC Q200 qualification, and increase current ratings.

EMI Filtering for High-Reliability Applications

EMI Filtering for High-Reliability Applications

EMI Filtering for High-Reliability Applications Written By: Amanda Ison Abstract: Electromagnetic interference (EMI), or electrical noise, is generated by everything from cellphones to solar flares and can make accurate signal transmission as difficult as trying to have a clear conversation in a noisy room. To improve signal clarity in electronic circuits, device designers turn to EMI suppression filters. Effective EMI filtering is necessary for almost every modern electronic device, including devices that generate their own EMI, as well as devices that are sensitive to EMI within their environment, and is especially important in high-reliability applications that utilize lower-power signals and have strict signal fidelity demands. High-reliability EMI filters are designed to consistently meet or exceed performance requirements and are vitally