Capacitor Array — An Integrated Passive Component Offering Benefits to the Automotive Sector Written By: Mark Stewart Abstract: By combining discrete capacitors into a multi-element package, AEC-Q qualified capacitor arrays offer automotive designers the opportunity to lower placement costs, increase assembly line output through lower component count per board and reduce real estate requirements.
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The 3 Rs of IDCs: Reliability, Repeatability, Reparability Written By: Tom Anderson Abstract: Even after more than 50 years in the marketplace, insulation displacement connectors (IDCs) continue to prove themselves in new and demanding applications, such as automotive safety systems, solid-state lighting (SSL), and industrial sensors and controls. IDCs have provided a cost-effective and reliable alternative to crimp-to-wire and hard-soldering wires to a PCB.
Optimizing Antenna Performance Through the Use of High Q, Tight Tolerance Capacitors Written By: Ron Demcko Abstract: Antenna matching is an important aspect of any RF system. Thinking in traditional terms, a properly designed and matched antenna increases the operating distance of the wireless product. Well matched antennas can transmit more power from the radio – therefore transmit over longer distances. Likewise, a well matched antenna allows the maximum transfer of energy from the receiving antenna to the receiver front end. Thus, allowing better receive characteristics for the system. But the use of a capacitor can also have a big impact upon the physical size of an antenna. If the goal is a compact, integrated antenna, the use of a
Portable Electronics Require Smaller, More Modular SMT Battery Connectors Written By: Tom Anderson Abstract: Next-generation battery connectors face many new market demands, although the common ingredients remain the same: high life cycle, stability, simple design, and SMT compatibility.
Aluminum Electrolytic Capacitor Holder For Ruggedized Automotive Applications Written By: Tom Anderson Abstract: Harsh environments such as automotive and industrial applications can be very demanding on larger electronic components, which are exposed to severe shock and vibration requirements. In order to protect these components, extra attention and most often times cost needs to be devoted to the processing and mechanical attachment within the device to the Printed Circuit Board (PCB).
The Frequency Response Effects of Internal Component Configuration on Multiple Ceramic Dielectric System Written By: S. Pala | R. Demcko | M. Berolini Abstract: The purpose of this paper is to discuss the frequency response effects of internal designs within ceramic systems. Those effects will be related to component performance parameters for devices used to suppress ESD and control EMI in high speed data lines, which are prone to be damaged by ESD. As communication speed increase, systems become more complicated and performance standards tighten, options to improve EMI/RFI performance becomes of great importance. Long term EMI performance and reliability are of particular importance in automotive, medical and aviation application sectors. A performance comparison will be made between single element
SMT Process Characteristics of AVX TransGuards Written By: Ron Demcko Abstract: TransGuards are uniquely suited for wide-scale usage in SMT applications. TransGuards exhibit many advantages when used in SMT assemblies. This paper is a general guideline aimed at familiarizing users with the characteristics of soldering multilayer SMT ZnO TransGuards.
LCD Driver Circuit EMI Filtering Options Written By: Ron Demcko Abstract: A review of EMI filter component options, comparing product performance, device characteristics and related factors (eg PCB board area, placement cost, etc.).
Charge Control Methods for SuperCapacitors: Methods to Protect Power Sources from Damage Due to High Current Demands of SuperCapacitors Written By: Ron Demcko | Joe Hock | Ashley Stanziola | Daniel West Abstract: Circuit designs exploiting the increased energy storage provided by supercapacitors, requires careful consideration of the increased power handling, than that of batteries, when charging these devices. The unique composition of electrochemical double-layer capacitors (EDLC) inherently allows them to withstand large currents. Table 1 below is a brief list of AVX cylindrical (SCC) and series-connected module (SCM) SuperCapacitors, displaying peak current supply and sink current capability. These maximum specifications will typically exceed current capability of charge sources, and lead to failures within the power supply system. Supercapacitors have
Equivalent Circuit Model for Tantalum and Niobium Oxide Capacitors for use in Simulation Software Written By: J. Pelcak Abstract: In electrical circuit simulations with simulation software, ideal passive components (resistors, capacitors, inductors) are typically used because real component characteristics have been difficult to model. Unfortunately, ideal and real passive components have significant differences in their electrical behavior. These differences lead to discrepancies between actual hardware performance and expected results based upon simulation software programs. This paper will describe the development of equivalent circuit diagram for modeling real capacitor behavior. Use of this real model in simulation software can help make circuit development more efficient, as the circuits in the simulations should have similar behavior to the actual circuits. The model