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| AVX Technical Information > Decoupling/Low Inductance |
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| Document Title | Author | Date | Technical Paper |
| AC Termination for Signal Busses | Ben Smith | 7/14/2006 9:38:00 AM |
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| Decoupling: Basics | AVX Corp. | 7/14/2006 9:38:00 AM |
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| Functional Testing of Decoupling Capacitors for Dynamic RAMs | A. Martin, W. Parkinson | 7/14/2006 9:37:00 AM |
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| Improved Noise Suppression Via MLCs in Power-Entry Decoupling | A. Martin, R. Keenan | 7/14/2006 9:38:00 AM |
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| Inductance Measurements for Multi-Terminal Devices | Ben Smith | 7/14/2006 9:38:00 AM |
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| Interconnect Schemes for Low Inductance Ceramic Capacitors | Jeff Cain, Ph.D. | 8/10/2006 11:37:00 AM |
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| Introduction to Choosing MLC Capacitors for Bypass/Decoupling Applications | AVX Corp. | 7/14/2006 9:39:00 AM |
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| Land Grid Array (LGA) Low Inductance Capacitor Advantages in Military and Aerospace Applications | AVX | 12/19/2006 4:25:00 PM |
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| LICA (Low Inductance Capacitor Array) Flip-Chip Application Notes | Jeff Cantlebary | 8/10/2006 11:37:00 AM |
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| LICA® Design Guide | AVX | 7/26/2006 11:01:00 AM |
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