Wire Bondable Interposers
Features & Benefits
- Pad to Pad Spacing Down to 15um
- High Conductivity Lines and Complex Routings
- Bond Pads Compatible for High Speed Wire Bonding
- Optical Communications
- Any Electronic System
The interposer can be utilized in a system in package serving as a high density substrate with a redistribution layer as well as offering precise linewidth control, increased performance, low power consumption, and high transmission speed.