Transmission Line MIM


MIM-img
Features & Benefits
  • HFSS Design Unique for Every Device
  • Gold Wire Bondable
  • Copper Conductor Design for Improved Circuit Conductivity
  • Designs Optimized for RF/Performance
  • RoHS Compliant
Typical Applications
  • DC Blocking at UHF
  • High Frequency Link
  • RF/Microwave Applications

AVX Thin Film Technologies is pleased to introduce a novel MIM (Metal-Insulator-Metal) capacitor using a transmission line wire bond pad structure with backside ground. The TL MIM can be supplied on quartz, alumina, glass and other substrates to minimize losses. Copper traces are used for optimal conductivity. Front and backside gold metalization make this device suitable for epoxy, gold wire bond/ribbon bond attachments

Datasheet / Catalogs
Datasheet / Catalogs – Click to Download
Part Number Information

Part Number Information

MIM Series
» Click to View

Contact Us