Microleaf – 5846 Series

Kyocera Connector Products ©
Features & Benefits
  • Contact Material: Copper alloy
  • Insulator Material: Heat-resistant plastic
  • Operating Temperature Range: -40 to +85°C
Typical Applications
  • Notebook PCs
  • Mobile devices

The 5846 Series are 0.4mm pitch Board to Board Connectors developed to meet market needs for high-density packaging and downsizing in notebook PCs, mobile devices, etc. These products have achieved a stacking height of 3.0mm and a width of 5.8mm including leads. As there is a bottom surface on the back of the connector and the contact part is not exposed, wiring patterns can be flexibly laid out on the substrate area which is positioned between the terminals. Suitable for high density mounting. In order to obtain high contact reliability, a pinching structure, which is highly resistant to vibrations and drop shocks, is adopted for the contact structure. In addition, an original structure in the contact points eliminates foreign matters such as scattered flux. A pendulum spring structure and an original locking structure have been adopted for the mating system, which achieves a secure “click” feeling, low mating force and high retention force. A checker (inspection jig) connector is also available for carrying out easy checks on conductivity and short circuits in connectors under mated conditions.

Datasheet / Catalog
Datasheet / Catalog – Click to Download
Part Number Information

Part Number Information

5846 Series
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Technical Information
Technical Information – Click to Download

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EDS 2018