Super Microleaf – 5602 Series

5602 Series
Kyocera Connector Products ©
Features & Benefits
  • Twin-Rib feature enhances retention force
  • Designed to prevent solder wicking
  • Can be mounted on FPC cables
  • Insulator Material: Heat-resistant plastic
Typical Applications
  • Mobile phones
  • Notebook PCs
  • Digital cameras

The 5602 Series are 0.4mm pitch Board to Board Connectors with a stacking height of 1.5mm. These connectors are designed to meet the need for miniaturization in the portable equipment market. Applications include mobile phones, mobile PCs, thin notebook PCs, DSCs (Digital Still Cameras), DVCs (Digital Video Cameras) and other complex equipment.

Datasheet / Catalog
Datasheet / Catalog – Click to Download
Part Number Info

Part Number Info

5602 Series
» Click to View

Technical Information
Technical Information – Click to Download

For more information on this Kyocera Connector Series, click here.
Request Sample
Contact US
EDS 2018